Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
US7070687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2001 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76888
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer. In another embodiment of a method of this invention, a substrate is provided into an electroplating tool chamber. The substrate has a barrier layer formed thereon, a metal seed layer formed on the barrier layer and a passivation layer formed over the metal seed layer. The method continues by annealing the substrate in forming gas to reduce the passivation layer. A conductive material is deposited on the substrate using an electrolytic plating or electroless plating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.