Circuitized substrate assembly and method of making same
US7071423B2 · kind B2 · utility
4Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2004 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Nov 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.