System and method for passing particles on selected areas on a wafer
US7071478B2 · kind B2 · utility
2Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Oct 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31788
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and system is disclosed for directing charged particles on predetermined areas on a target semiconductor substrate. After aligning a wafer mask with a semiconductor wafer, with the wafer mask having one or more mask patterns thereon, the charged particles are directed to pass through the mask patterns to land on one or more selected areas on the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.