Method of making contact with circuit units to be tested in a tester and contact-making apparatus for implementing the method
US7074072B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Jul 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A contact-making apparatus for making contact with circuit units to be tested in a tester contains a printed circuit board device that has electrical connections to the tester, and a test module device. The test module device has first contact-making elements for making electrical contact between the test module device and the printed circuit board device, and second contact-making elements for making electrical contact between the test module device and the circuit unit to be tested. When the printed circuit board device and the circuit unit to be tested are pressed onto each other, a spring force of the first contact-making elements is lower than the spring force of the second contact-making elements under a low initial compression, and a spring force of the first contact-making elements are higher than the spring force of the second contact-making elements under a high final compression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.