Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
US7074653B2 · kind B2 · utility
3Cited by
3References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2004 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Aug 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.