Substrate treating method and substrate treating apparatus
US7074726B2 · kind B2 · utility
4Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Jan 23, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.