Electrostatic gripping device
US7075772B2 · kind B2 · utility
5Cited by
8References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 5, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | May 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing process and can be operated with a DC voltage of less than 900 V. As a result, heating of the wafer is almost completely prevented even under a vacuum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.