Microelectronic device interconnects
US7078822B2 · kind B2 · utility
46Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Oct 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.