Semiconductor interconnect having semiconductor spring contacts
US7078922B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Feb 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on the component. The interconnect contacts include flexible spring segments defined by grooves in the substrate, shaped openings in the substrate, or shaped portions of the substrate. The spring segments are configured to flex to exert spring forces on the component contacts, and to compensate for variations in the size or planarity of the component contacts. The interconnect can be configured to test wafer sized components, or to test die sized components. A test method includes the steps of providing the interconnect with the interconnect contacts, and electrically engaging the component contacts under a biasing force from the spring segments. A wafer level test system includes the interconnect mounted to a testing apparatus such as a wafer probe handler. A die level test system includes the interconnect mounted to a test carrier for discrete components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.