Inventor · Eagle, ID, US

Kyle K. Kirby

210Patents
25h-index
48Co-inventors
90Inventor score

Filing activity: Jun 1, 1998 → Dec 29, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6841883B1 Multi-dice chip scale semiconductor components and wafer level methods of fabrication Electricity 455 Expired
US7498675B2 Semiconductor component having plate, stacked dice and conductive vias Electricity 273 Active
US8030780B2 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Electricity 239 Active
US7300857B2 Through-wafer interconnects for photoimager and memory wafers Electricity 135 Expired
US7109068B2 Through-substrate interconnect fabrication methods Electricity 111 Expired
US7091124B2 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices Electricity 89 Expired
US7271482B2 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods Electricity 77 Expired
US7232754B2 Microelectronic devices and methods for forming interconnects in microelectronic devices Electricity 70 Expired
US6924655B2 Probe card for use with microelectronic components, and methods for making same Emerging Cross-Sectional Technologies 58 Expired
US7411304B2 Semiconductor interconnect having conductive spring contacts Electricity 58 Expired
US7060526B2 Wafer level methods for fabricating multi-dice chip scale semiconductor components Electricity 57 Expired
US7645635B2 Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages Electricity 55 Expired
US7262134B2 Microfeature workpieces and methods for forming interconnects in microfeature workpieces Electricity 54 Expired
US7459393B2 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts Electricity 52 Active
US7452743B2 Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level Electricity 44 Active
US7129567B2 Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements Electricity 44 Expired
US6250688A Ramp-lock lifting device Emerging Cross-Sectional Technologies 44 Expired
US7759800B2 Microelectronics devices, having vias, and packaged microelectronic devices having vias Electricity 44 Expired
US7495316B2 Methods of forming conductive vias and methods of forming multichip modules including such conductive vias Electricity 42 Active
US6998717B2 Multi-dice chip scale semiconductor components Electricity 39 Expired
US7531453B2 Microelectronic devices and methods for forming interconnects in microelectronic devices Electricity 39 Active
US7968460B2 Semiconductor with through-substrate interconnect Electricity 36 Active
US7078922B2 Semiconductor interconnect having semiconductor spring contacts Emerging Cross-Sectional Technologies 34 Expired
US7683458B2 Through-wafer interconnects for photoimager and memory wafers Electricity 33 Active
US7829976B2 Microelectronic devices and methods for forming interconnects in microelectronic devices Electricity 27 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.