Device and system for heat spreader with controlled thermal expansion
US7081669B2 · kind B2 · utility
5Cited by
3References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Jul 25, 2006 |
| Priority date | — |
| Expiry date | Apr 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.