Bonded wafer optical MEMS process
US7083997B2 · kind B2 · utility
19Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 3, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/014
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the micromechanical structure for movement. One particular micromechanical structure described is a micromirror.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.