PCB method and apparatus for producing landless interconnects
US7084354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper portion extends to the trace to expose a portion of the trace. A second elongate trace is formed on the upper portion. A portion of the second elongate trace positioned in the opening formed through the upper surface of the upper portion contacts the first elongate trace through the opening to form an electrical interconnection between the first trace and the second trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.