Photosensitive semiconductor package and method for fabricating the same
US7084474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
Abstract
A photosensitive semiconductor package and a method for fabricating the same are proposed. The package includes a carrier having a first surface, an opposite second surface, and an opening penetrating the carrier; a photosensitive chip having an active surface and a non-active surface, wherein a plurality of bond pads are formed close to edges of the active surface, and the chip is mounted via corner positions of its active surface to the second surface of the carrier, with the bond pads being exposed via the opening; a plurality of bonding wires formed in the opening, for electrically connecting the bond pads of the chip to the first surface of the carrier; a light-penetrable unit attached to the active surface of the chip and received in the opening; and an encapsulant for encapsulating the bonding wires and peripheral sides of the chip to seal the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.