Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
US7085135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.