Heat sink structure with flexible heat dissipation pad
US7086458B2 · kind B2 · utility
2Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Apr 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink module includes a heat dissipation pad. The heat dissipation pad is flexible and has a cambered shape, and is pressed to become a flat plate when disposed between the heat sink module and a CPU. The heat dissipation pad restores to its original cumbered shape and lifts the heat sink module away from a CPU when a fixing device that fixes the heat sink module to the CPU is disabled. Therefore, one can easily removes the heat sink module without any additional tools or processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.