Method and apparatus for thermally assisted testing of integrated circuits
US7087439B2 · kind B2 · utility
4Cited by
7References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Dec 20, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for thermally testing integrated circuits, comprising a temperature generation device located within the IC, configured with a primary purpose of affecting a temperature at the IC. A temperature sensor is located within close proximity to the IC, and a temperature controller is coupled to the temperature generation device and to the temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.