Post-CMP washing liquid composition
US7087562B2 · kind B2 · utility
10Cited by
9References
5Claims
0Family size
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Inventors
Key dates
| Filing date | May 9, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Nov 3, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A post-CMP washing liquid composition is provided which includes one type or two or more types of aliphatic polycarboxylic acids and one type or two or more types selected from the group consisting of glyoxylic acid, ascorbic acid, glucose, fructose, lactose, and mannose, and which has a pH of less than 3.0. This washing liquid has excellent performance in removing micro particles and metal impurities adhering to the surface of a semiconductor substrate after CMP and does not corrode a metal wiring material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.