Semiconductor packaging apparatus
US7087988B2 · kind B2 · utility
14Cited by
24References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2002 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary embodiment of the present invention described and shown in the specification and drawings is a semiconductor packaging apparatus that includes a first substrate for coupling to an electronic component, and a second substrate for accommodating the electronic component coupled to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.