Non-contact method and apparatus for on-line interconnect characterization in VLSI circuits
US7088121B1 · kind B1 · utility
1Cited by
9References
45Claims
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Key dates
| Filing date | Nov 17, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system that facilitates non-invasive in-line characterization of parameters of VLSI circuit interconnects is provided. A plurality of micro-electro-mechanical system (MEMS) cantilevers apply voltage(s) to VLSI circuit interconnect(s) without physical contact thereto. A measuring component measures deflection characteristics of the cantilevers, the deflection(s) correspond to electrical forces generated from the applied voltage(s) as passed through VLSI circuit interconnect(s). A component computes characteristics of the VLSI interconnect based at least in part upon the measured deflection characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.