Poly(arylene ether) adhesive compositions
US7090920B2 · kind B2 · utility
4Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2005 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Feb 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31794
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.