Electronic assembly comprising solderable thermal interface and methods of manufacture
US7091063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Feb 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated heat spreader. In one embodiment, the die is mounted on an organic substrate using a C4 and land grid array arrangement. In order to maximize thermal dissipation from the die while minimizing warpage of the package when subjected to heat, due to the difference in thermal coefficients of expansion between the die and the organic substrate, a thermal interface is used that has a relatively low melting point in addition to a relatively high thermal conductivity. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.