Semiconductor device
US7091587B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 9, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Oct 13, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power supply voltage to amplifier circuit parts of a power module of a digital cellular phone, is electrically connected to a wiring in an internal layer of the module board through a plurality of via holes. Further, the wiring is electrically connected to an electrode for the supply of the power supply voltage, which is provided on a back surface of the module board. Accordingly, an output characteristic of the semiconductor device is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.