Pressure sensor having a silicon chip on a steel diaphragm

US7093493B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hubert Benzel · Neckartenzlingen, DE
• Masoud Habibi · Schwieberdingen, DE
• Gilbert Moersch · Stuttgart, DE
• Roland Guenschel · Reutlingen, DE
• Jan Gebauer · Karlsruhe, DE

Key dates

• Filing date: Feb 9, 2005
• Grant date: Aug 22, 2006
• Expiry date: Feb 9, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L9/0055
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.