Heat treatment apparatus and method of semiconductor wafer
US7094994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2004 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Jul 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer heat treatment apparatus and method, which can carry out a heat treatment to suppress variations in line widths within a surface on a semiconductor wafer and the like, includes: a heating plate for heating a semiconductor wafer to a predetermined temperature; a temperature measuring unit for measuring temperatures when heating the semiconductor wafer or a semiconductor wafer equivalent placed on the heating plate, at portions divided into a plurality of regions; and a controller for controlling the temperatures of the semiconductor wafer, and based on the temperature measurement result of the temperature measuring unit, the controller controls the temperature in heating the semiconductor wafer, for each of the plurality of regions. In cooling after the heating process, based on the temperature measurement result, the controller controls the temperature in cooling the semiconductor wafer, for each of the plurality of regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.