Contacting scheme for large and small area semiconductor light emitting flip chip devices

US7095061B2 · kind B2 · utility

Assignee

• Philips Lumileds Lighting Company LLC · US

Inventors

• Daniel A. Steigerwald · Eindhoven, NL
• Jerome Chandra Bhat · San Francisco, US
• Michael J. Ludowise · San Jose, US

Key dates

• Filing date: Oct 7, 2004
• Grant date: Aug 22, 2006
• Expiry date: Oct 7, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

A light emitting device includes a layer of first conductivity type, a layer of second conductivity type, and a light emitting layer disposed between the layer of first conductivity type and the layer of second conductivity type. A via is formed in the layer of second conductivity type, down to the layer of first conductivity type. The vias may be formed by, for example, etching, ion implantation, diffusion, or selective growth of at least one layer of second conductivity type. A first contact electrically contacts the layer of first conductivity type through the via. A second contact electrically contacts the layer of second conductivity type. A ring that surrounds the light emitting layer and is electrically connected to the first contact electrically contacts the layer of first conductivity type.