Ball assignment schemes for integrated circuit packages
US7095107B2 · kind B2 · utility
17Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2004 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure is directed to ball assignment schemes for ball grid array packages in integrated circuits with increased signal count. The ball assignment scheme includes an array of electrical contacts. The array has a first diagonal including a pair of signal contacts adjacent to a pair of first-type voltage supply contacts. The array further includes a crossing diagonal having a pair of adjacent second-type voltage supply contacts, which crosses the first diagonal between the pair of signal contacts such that the pair of second-type voltage supply contacts oppose one another relative to the first diagonal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.