Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
US7095112B2 · kind B2 · utility
12Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2003 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Dec 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided a semiconductor device including: a wiring board; a semiconductor chip having a pad electrically connected to a wiring on the wiring board; a second semiconductor chip provided on the wiring board at a position facing a side of the semiconductor chip, having passive elements integrated therein, and having pads for external connection to which both ends of the passive elements are connected respectively and at least one of which is electrically connected to the wiring on the wiring board electrically connected to the pad of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.