CMP method for noble metals
US7097541B2 · kind B2 · utility
13Cited by
19References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2003 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/694
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP system comprises an abrasive and/or polishing pad, a liquid carrier, and a sulfonic acid compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.