Polishing pad
US7097549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Nov 29, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L101/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.