Mechanical enhancement of dense and porous organosilicate materials by UV exposure
US7098149B2 · kind B2 · utility
557Cited by
12References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2003 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Mar 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.