Mark Daniel Bitner
10Patents
6h-index
7Co-inventors
55Inventor score
Filing activity: Nov 14, 2002 → Jul 3, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7098149B2 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Electricity | 557 | Expired |
| US7468290B2 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Electricity | 24 | Expired |
| US7404990B2 | Non-thermal process for forming porous low dielectric constant films | Electricity | 19 | Expired |
| US8399349B2 | Materials and methods of forming controlled void | Electricity | 8 | Active |
| US7932188B2 | Mechanical enhancement of dense and porous organosilicate materials by UV exposure | Electricity | 7 | Active |
| US7470454B2 | Non-thermal process for forming porous low dielectric constant films | Electricity | 7 | Expired |
| US7074489B2 | Low dielectric constant material and method of processing by CVD | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8137764B2 | Mechanical enhancer additives for low dielectric films | Emerging Cross-Sectional Technologies | 1 | Active |
| US8846522B2 | Materials and methods of forming controlled void | Electricity | 1 | Active |
| US9293361B2 | Materials and methods of forming controlled void | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.