Method of fabrication of semiconductor integrated circuit device
US7098156B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Apr 4, 2002 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Aug 6, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The conveyance of wafers in bays (equipment groups) of a clean room is performed by RGVs (Rail Guided Vehicles) that linearly travel at high speed on conveying rails laid on the floor of the clean room. A structure is adopted wherein a conveying area, over which the RGV travels, is separated from a human working area by a compartment (partition), and a human is not allowed to enter the conveying area upon operation of a line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.