Semiconductor chip with borderless contact that avoids well leakage
US7098515B1 · kind B1 · utility
6Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2005 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Apr 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive semiconductor chip is provided. Generally, shallow trenches containing field oxide are provided on a substrate. At least one semiconductor device is formed between the shallow trenches. An oxide layer is formed over the at least one semiconductor device and the field oxide. An etch stop layer is formed over the oxide layer. An inter layer dielectric layer is formed over the etch stop layer. At least one contact hole is etched through the inter layer dielectric layer, the etch stop layer and at least partially through the oxide layer. The contact hole is filled with a conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.