Method of mounting an electronic part
US7100279B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Nov 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49197
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.