Single-layer polishing pad and method producing the same
US7101501B2 · kind B2 · utility
5Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2005 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | May 3, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.