Spin coating for maximum fill characteristic yielding a planarized thin film surface
US7101771B2 · kind B2 · utility
0Cited by
28References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2001 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Nov 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for spinning a material onto a semiconductor device structure so as to substantially fill recesses formed in a surface of the semiconductor device structure and to impart the material with a substantially planar surface and semiconductor device structures formed thereby. The thickness of the material covering the surface is less than the depth of the recesses. The surface may remain substantially uncovered by the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.