Device and method for package warp compensation in an integrated heat spreader
US7102226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2005 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Feb 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.