Method of manufacturing piezoelectric wafers of saw identification tags
US7103948B1 · kind B1 · utility
5Cited by
5References
8Claims
0Family size
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Key dates
| Filing date | Jan 28, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Jun 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that encode digits of a first significance for SAW identification tags; and (2) using different ones of a library of coding reticles to form, on each of the piezoelectric wafers, wafer-dependent patterns that encode digits of a second significance for SAW identification tags.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.