Packaged semiconductor with coated leads and method therefore
US7105383B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Mar 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die is housed in a package body. Leads, which are electrically coupled to the semiconductor die, extend from the package body and are for connecting to a printed circuit board or other device. The leads are coated with a material that protects the leads from oxidation. The coating is compatible with solder techniques that are commonly used to attach packaged semiconductors to a printed circuit board. In some examples, the coating is removable, after drying, at temperatures below one hundred eighty degrees Celsius. This allows for solder processes, which are typically at least 180° C., to remove the coating thereby exposing the leads, which has been protected from oxidation, so that it can be soldered to the printed circuit board. In some examples, the coating material includes an organic material. In some examples, the coating material is an organic solderability preservative (OSP).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.