Apparatus for pre-conditioning CMP polishing pad
US7105446B2 · kind B2 · utility
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7Claims
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Assignee
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Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Nov 30, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method suitable for the pre-conditioning of a polishing pad on a CMP apparatus prior to the polishing of production wafers on the apparatus. The apparatus includes a pre-conditioning arm on which is mounted an ingot of suitable material. In use, the ingot is pressed against the polishing surface of the rotating polishing pad for a selected period of time to increase the temperature of the polishing surface by friction. The pre-conditioned polishing pad facilitates uniform polishing rates of production semiconductor wafers subsequently polished on the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.