Device and method for including passive components in a chip scale package
US7105923B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Aug 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method and device for building one or more passive components into a chip scale package. The method includes the steps of selecting a passive component having a terminal pitch that is a multiple of the package ball pitch of a chip scale package and mounting the selected passive component terminals to ball sites of the package. A preferred embodiment of the invention uses a single metal layer polyamide tape as the substrate of the package. Additional preferred embodiments of the invention are disclosed in which the terminal pitch multiple of the package ball pitch is one or two. Devices corresponding to the disclosed methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.