Kevin Lyne
7Patents
3h-index
4Co-inventors
46Inventor score
Filing activity: Sep 20, 1999 → Jan 6, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6285560A | Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified | Electricity | 70 | Expired |
| US6689634B1 | Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability | Electricity | 30 | Expired |
| US8957525B2 | 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor | Electricity | 24 | Active |
| US8053349B2 | BGA package with traces for plating pads under the chip | Electricity | 3 | Active |
| US7449364B2 | Device and method for including passive components in a chip scale package | Emerging Cross-Sectional Technologies | 1 | Active |
| US7105923B2 | Device and method for including passive components in a chip scale package | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9312253B2 | Heterogeneous integration of memory and split-architecture processor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.