Universal spatial pattern recognition system
US7106897B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Mar 15, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for analyzing patterns in semiconductor wafers wherein the patterns are compared to a plurality of patterns stored in a common pattern library. A spatial pattern recognition engine is operable to receive a first set of data corresponding to a pattern on a semiconductor wafer and to generate a normalized contour representation of said first data set. A pattern analyzer compares the normalized data set to a plurality of reference contour data sets stored in a common pattern data reference library and generates a correlation label associating the first data set with one of the plurality of reference contour data sets. The label associated with the first data set is stored in a label storage database that can be accessed to perform subsequent analysis on the data associated with a specific wafer. The system can be used to analyze multiple types of patterns, including defect data, bin data, positional parameter data and in-line site data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.