Optimized heat sink using high thermal conducting base and low thermal conducting fins
US7108055B2 · kind B2 · utility
22Cited by
13References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 22, 2003 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Dec 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 3 times that of the base, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.