Finger metal-insulator-metal capacitor device with local interconnect
US7109565B2 · kind B2 · utility
1Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2003 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Oct 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
Abstract
The present invention includes a method of constructing a novel capacitor and geometry for the capacitor. The method and device include forming a multilayer structure having what generally can be described as a wave shape. Particular aspects of the present invention are described in the claims, specification and drawings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.