Hermetically sealed package for optical, electronic, opto-electronic and other devices
US7109580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2004 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0833
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.