System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US7109581B2 · kind B2 · utility
59Cited by
22References
24Claims
0Family size
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Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Oct 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/763
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.