Method for retesting semiconductor device
US7109740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Jun 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.