Electrical contacts in microelectromechanical devices with multiple substrates
US7110160B2 · kind B2 · utility
3Cited by
11References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Apr 8, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.